416 Microstructure and Strength Properties of Tin-Silver-Copper Solder Ball Bonded by Various Cooling Rates

Tremella fuciformis

Gut & microbiomeSkin & hydration

SpeciesSnow Fungus, Silver Ear

JournalThe Proceedings of the JSME Materials and Processing Conference (M&P)

Year2002

Metadata-grounded summary

Article summary

Metadata-grounded summary: This journal article indexes research on Tremella fuciformis in The Proceedings of the JSME Materials and Processing Conference (M&P) in 2002. MycoData maps the paper to gut & microbiome, skin & hydration based on its title, species context, article metadata, and study classification.

Citation

Kunihiro Noguchi Mayumi Ikeda Takashi Nakamori Isao Shimizu Yasuhide Ohno (2002). 416 Microstructure and Strength Properties of Tin-Silver-Copper Solder Ball Bonded by Various Cooling Rates. The Proceedings of the JSME Materials and Processing Conference (M&P) https://doi.org/10.1299/jsmeintmp.10.2.35

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