Preparation and Properties of Composite Films Composed of Polyimide, Epoxy Resin and Silver Filler

Tremella fuciformis

Gut & microbiomeSkin & hydration

SpeciesSnow Fungus, Silver Ear

JournalJournal of The Japan Institute of Electronics Packaging

Year2005

Metadata-grounded summary

Article summary

Metadata-grounded summary: This journal article indexes research on Tremella fuciformis in Journal of The Japan Institute of Electronics Packaging in 2005. MycoData maps the paper to gut & microbiome, skin & hydration based on its title, species context, article metadata, and study classification.

Citation

Takashi MASUKO Shinji TAKEDA Yuji HASEGAWA (2005). Preparation and Properties of Composite Films Composed of Polyimide, Epoxy Resin and Silver Filler. Journal of The Japan Institute of Electronics Packaging https://doi.org/10.5104/jiep.8.116

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