Chip Scale Package Solder Joint Reliability Modeling and Material Characterization

Tremella fuciformis

Gut & microbiomeSkin & hydration

SpeciesSnow Fungus, Silver Ear

JournalJournal of The Japan Institute of Electronics Packaging

Year2000

Metadata-grounded summary

Article summary

Metadata-grounded summary: This journal article indexes research on Tremella fuciformis in Journal of The Japan Institute of Electronics Packaging in 2000. MycoData maps the paper to gut & microbiome, skin & hydration based on its title, species context, article metadata, and study classification.

Citation

Masazumi AMAGAI (2000). Chip Scale Package Solder Joint Reliability Modeling and Material Characterization. Journal of The Japan Institute of Electronics Packaging https://doi.org/10.5104/jiep.3.45

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